To prohibit covered entities that receive financial assistance relating to semiconductors from purchasing certain semiconductor manufacturing equipment from foreign entities of concern or subsidiaries of foreign entities of concern, and for other purposes.
Analysis under review: This bill has generated analysis that may be too generic or incomplete. Clause-level evidence remains available below.
Summary
What This Bill Does
This bill, To prohibit covered entities that receive financial assistance relating to semiconductors from purchasing certain semiconductor manufacturing equipment from foreign entities of concern or subsidiaries of foreign entities of concern, and for other purposes., changes federal law or congressional policy affecting defense agencies, service members, and defense contractors. The main policy domain is Defense, Trade, Finance.
Who Benefits and How
defense agencies, service members, and defense contractors may benefit from new authority, funding, eligibility, regulatory clarity, or reduced risk created by the bill.
Who Bears the Burden and How
federal implementing agencies, defense agencies, service members, and defense contractors may take on implementation duties, reporting obligations, compliance costs, or oversight responsibilities.
Key Provisions
- Section HC2EC44A6AA8D4E9288DFB6502B543999: 1. Short title This Act may be cited as the Chip Equipment Quality, Usefulness, and Integrity Protection Act of 2024 or the Chip EQUIP Act.
- Section H1936ECC1E2A9497F9FF110438997437D: 2. Definitions Section 9901 of the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 (15 U.S.C. 4651) is amended— by...
Evidence Chain:
This summary is generated from the full bill text using AI analysis. Expand "Detailed Analysis" below for identified beneficiaries/burden bearers with clause-level evidence links.
At a Glance
What This Bill Does
This bill, To prohibit covered entities that receive financial assistance relating to semiconductors from purchasing certain semiconductor manufacturing equipment from foreign entities of concern or subsidiaries of foreign entities of concern, and for other purposes., changes federal law or congressional policy affecting defense agencies, service members, and defense contractors.
Key Policy Areas
Defense, Trade, Finance
Primary Purpose
This bill, To prohibit covered entities that receive financial assistance relating to semiconductors from purchasing certain semiconductor manufacturing equipment from foreign entities of concern or subsidiaries of foreign entities of concern, and for other purposes., changes federal law or congressional policy affecting defense agencies, service members, and defense contractors.
Policy Domains
Whole bill
Identified Gains
- defense agencies, service members, and defense contractors
Identified Costs
- federal implementing agencies
- defense agencies, service members, and defense contractors
Sponsors
Legislative Progress
IntroducedMs. Lofgren (for herself and Mr. Lucas) introduced the following …
Impact analysis is available but no clear stakeholder effects identified. View clause-level analysis →
Bill Structure & Actor Mappings
Who is "The Secretary" in each section?
- "secretary_of_defense"
- → Secretary of Defense
Key Definitions
Terms defined in this bill
the state in which all (or substantially all) necessary parts, chambers, subsystems, and subcomponents have been put together, resulting in a ready-to-use or ready-to-install item to be directly purchased from an entity
We use a combination of our own taxonomy and classification in addition to large language models to assess meaning and potential beneficiaries. High confidence means strong textual evidence. Always verify with the original bill text.
Learn more about our methodology