HR8170-119

What This Bill Does

The MATCH Act addresses export controls on semiconductor manufacturing equipment and components. Its sense of Congress says such controls are one of the United States' most effective defenses of foundational technology, that advanced computing and artificial intelligence are transforming military affairs, and that U.S. and allied advantages in advanced-node integrated circuits, production equipment, and software should be protected. It names companies such as CXMT, Hua Hong, Huawei, SMIC, YMTC, AMEC, NAURA, Piotech, ACM Research, PNC Process Systems, Skyverse, SMEE, Kingsemi, and Hwatsing as engaged in advanced-node integrated-circuit production efforts tied to the People's Republic of China's military-civil fusion efforts. Substantively, within 60 days and annually thereafter, covered agency heads must identify all covered semiconductor manufacturing equipment and covered facilities and report them to Congress. They must immediately pursue allied countrywide controls and license requirements for covered facilities with a licensing policy of denial, brief Congress within 90 days on diplomatic progress and incentives, publish regulations within 150 days and annually to ensure U.S. controls cover U.S.-origin equipment and covered facilities in countries of concern, and either certify by day 150 that all allied supplier countries have implemented equivalent controls or report countries and gaps.

Who Benefits and How

U.S. semiconductor-equipment manufacturers benefit from a more coordinated allied control regime that may reduce diversion to PRC military-linked facilities. Allied supplier countries benefit from clear U.S. expectations and incentives for adopting controls. U.S. national-security agencies benefit from annual equipment and facility lists and required regulations. Congressional export-control committees benefit from 60-day lists, 90-day briefings, and 150-day certification or gap reports. Domestic advanced-node chip producers benefit if controls slow foreign military-civil fusion competitors. Export-control compliance teams benefit from clearer covered-equipment and covered-facility definitions once regulations are issued.

Who Bears the Burden and How

Covered agency heads must conduct annual reviews, diplomatic engagement, congressional briefings, regulations, certifications, and reports. BIS licensing staff must implement controls over U.S.-origin semiconductor manufacturing equipment and covered facilities in countries of concern. Semiconductor equipment exporters face broader countrywide controls, license requirements, and licensing-denial policies. Allied governments face U.S. diplomatic pressure to adopt equivalent controls and licensing policies. PRC semiconductor manufacturers named in the findings face higher risk of being cut off from U.S. and allied equipment and servicing. Covered facilities in countries of concern face comprehensive U.S. restrictions and servicing controls.

Key Provisions

• States congressional findings on semiconductor manufacturing equipment controls, advanced computing, and PRC military-civil fusion.
• Requires covered agency heads to identify covered equipment and facilities within 60 days and annually.
• Directs immediate diplomatic engagement for allied countrywide controls and license-denial policies.
• Requires a 90-day congressional briefing on allied-control diplomacy, incentives, lagging countries, and U.S. measures.
• Requires regulations within 150 days and annually to cover U.S.-origin equipment and covered facilities in countries of concern.
• Requires certification that allied supplier countries have implemented controls or reports identifying gaps.