HR6275-119

In Committee

China AI Power Report Act

119th Congress Introduced Nov 21, 2025

Summary

What This Bill Does

The China AI Power Report Act states that AI export controls must be dynamic and that Congress needs current information on China’s artificial intelligence capabilities. Within 180 days and annually for three years, the Commerce Secretary, consulting covered agency heads, must report to House Foreign Affairs and Senate Banking on China’s advanced AI capabilities and AI supply chains. The report must assess Chinese AI chip designers such as Huawei and Cambricon, including processing power, precision operations, memory, interconnect bandwidth, power efficiency, die size, process node, costs, yields, model portability, server configurations, production numbers, foundries, software ecosystems, foreign use, and translation-layer capabilities. It also must assess leading Chinese logic fabrication facilities such as SMIC, memory facilities such as CXMT and YMTC, export-controlled equipment, collaborations with non-Chinese firms, indigenization progress, market share, and multi-year trends.

Who Benefits and How

Congressional foreign affairs, banking, and export-control overseers benefit from recurring technical intelligence on China’s AI hardware and manufacturing base. Commerce and export-control officials benefit from structured reporting that can support updates to controls. U.S. semiconductor and AI infrastructure firms may benefit if better intelligence supports targeted controls against Chinese competitors.

Who Bears the Burden and How

The Department of Commerce and covered national-security agencies must collect highly technical data, consult across agencies, and report annually for three years. Chinese AI chip designers, foundries, and memory manufacturers face increased scrutiny that could support tighter export controls. Firms with China-related semiconductor collaborations may face more attention in the report.

Key Provisions

  • States that AI export controls should adapt to China’s changing capabilities and circumvention methods.
  • Requires Commerce to submit an initial report within 180 days and annual reports for three years.
  • Requires assessment of Chinese AI chip designers such as Huawei and Cambricon, including performance, production, foundries, software, and foreign use.
  • Requires assessment of Chinese logic and memory fabrication facilities, including SMIC, CXMT, and YMTC.
  • Requires reporting on export-controlled equipment, collaborations, indigenization progress, market share, and five-year trends.

Evidence Chain:

This summary is generated from the full bill text using AI analysis. Expand "Detailed Analysis" below for identified beneficiaries/burden bearers with clause-level evidence links.

At a Glance

What This Bill Does

Requires Commerce, with national-security agency partners, to report annually for three years on China’s advanced AI chips, semiconductor fabrication, memory, supply chains, and export-control implications.

Key Policy Areas

Technology, National Security, Trade

Primary Purpose

Requires Commerce, with national-security agency partners, to report annually for three years on China’s advanced AI chips, semiconductor fabrication, memory, supply chains, and export-control implications.

Policy Domains

Technology National Security Trade

Substantive provisions

Identified Gains
  • Congressional foreign affairs committees
  • Congressional banking committees
  • Commerce export control officials
  • U.S. semiconductor companies
Model: codex-gpt-5 | Version: bill_summary_v2 | Source: ih
U.S. semiconductor companies: ,
Congressional banking committees: ,
Commerce export control officials: ,
Congressional foreign affairs committees: ,
Identified Costs
  • Department of Commerce
  • Covered national security agencies
  • Chinese AI chip designers
  • Chinese semiconductor fabrication facilities
  • Firms collaborating with Chinese semiconductor companies
Model: codex-gpt-5 | Version: bill_summary_v2 | Source: ih
Department of Commerce: ,
Chinese AI chip designers: ,
Covered national security agencies: ,
Chinese semiconductor fabrication facilities: ,
Firms collaborating with Chinese semiconductor companies: ,

Legislative Progress

In Committee
Introduced Committee Passed
Nov 21, 2025

Mr. Moylan (for himself, Mr. Vindman, and Mr. Huizenga) introduced …

Nov 21, 2025

Referred to the House Committee on Foreign Affairs.

Nov 21, 2025

Introduced in House

Stakeholder Effects

cui bono?

How this legislation distributes effects. Mention counts reflect frequency, not effect magnitude.

Government
6 mentions across 2 clauses
+3 positive -2 negative ?1 uncertain

Commerce export control officials, Congressional banking committees, Congressional foreign affairs committees

Positive-direction: Commerce export control officials, Congressional banking committees, Congressional foreign affairs committees

Negative-direction: Covered national security agencies, Department of Commerce

Technology
2 mentions across 1 clause
+1 positive -1 negative

Chinese AI chip designers, U.S. semiconductor companies

Positive-direction: U.S. semiconductor companies

Negative-direction: Chinese AI chip designers

Manufacturing
1 mention across 1 clause
-1 negative

Chinese semiconductor fabrication facilities

3/3
sections analyzed
Full impact breakdown

Bill Structure & Actor Mappings

Who is "The Secretary" in each section?

Domains
Technology National Security Trade

We use a combination of our own taxonomy and classification in addition to large language models to assess meaning and potential beneficiaries. High confidence means strong textual evidence. Always verify with the original bill text.

Learn more about our methodology